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Pin-to-Tab Thermocompression Bond Fixture

IP.com Disclosure Number: IPCOM000100005D
Original Publication Date: 1990-Mar-01
Included in the Prior Art Database: 2005-Mar-15
Document File: 2 page(s) / 36K

Publishing Venue

IBM

Related People

Gruber, HW: AUTHOR [+3]

Abstract

Bonds between tabs and pins are generally established by thermocompression. If the tabs are on top of a polyimide surface, thermobonding can only be performed if the polyimide surface has a hole in the bonding area on the upper and lower side. Presently, the polyimide is removed by punching holes in its surface before plating the conductors onto the polyimide surface. The punching tool required for this purpose is expensive.

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Pin-to-Tab Thermocompression Bond Fixture

       Bonds between tabs and pins are generally established by
thermocompression.  If the tabs are on top of a polyimide surface,
thermobonding can only be performed if the polyimide surface has a
hole in the bonding area on the upper and lower side.  Presently, the
polyimide is removed by punching holes in its surface before plating
the conductors onto the polyimide surface.  The punching tool
required for this purpose is expensive.

      Punching can be avoided if the holes in the polyimide surface
are produced by high-voltage arcing.  This method can be performed by
the device shown in the figure.   A copper foil 1 is fixed to
polyimide surface 2.  Pin 3, which is thermobonded to copper foil 1
later on, is held in a hole 4 of a pin matrix carrier 5.  A
thermocompression bond electrode 6 is positioned above the future
bonding area. Electrode 6 and pin 3 or pin matrix carrier 5 are
connected to a high-voltage arcing generator (not shown) prior to
thermobonding.  By this simple method, the polyimide surface opposite
the front end region of the thermocompression bond electrode 6 is
burned off.