Browse Prior Art Database

Utilizing Coax for Overflow Wires On Clark Boards

IP.com Disclosure Number: IPCOM000100045D
Original Publication Date: 1990-Mar-01
Included in the Prior Art Database: 2005-Mar-15
Document File: 2 page(s) / 47K

Publishing Venue

IBM

Related People

Boone, LE: AUTHOR [+3]

Abstract

Shorter machine cycle times and faster rise times have necessitated a greater awareness of coupled noise on signal transmission lines.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

Utilizing Coax for Overflow Wires On Clark Boards

       Shorter machine cycle times and faster rise times have
necessitated a greater awareness of coupled noise on signal
transmission lines.

      Disclosed is an idea that eliminates coupled noise, distortion,
ground bond test, back plane artwork inspection/repair, and cost of
retainers and combs.  Reductions will also be achieved in time delay,
crossover noise, and signal to power shorts.

      These benefits would be achieved by replacing the ground grid
on the back of large (CLARK-type) boards with a copper sheet
approximately 1.2 mils thick and a dry film solder mask before the
solder operation.  The solder would then coat the signal pad and on
the area around the signal pad (Fig. 1).  The coax wire could then be
soldered to the signal pad and ground in one step (Fig. 2).