Browse Prior Art Database

Hybrid Wafer Scale Interconnection Flex Tape Package Connector Mount to Card

IP.com Disclosure Number: IPCOM000100068D
Original Publication Date: 1990-Mar-01
Included in the Prior Art Database: 2005-Mar-15
Document File: 3 page(s) / 69K

Publishing Venue

IBM

Related People

Robbins, MA: AUTHOR

Abstract

Very large-scale integration (VLSI) devices can be optimized with a hybrid wafer scale interconnection (HWSI) pack- age interconnected to the system card with a flex tape and surface-mount connector technique.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 70% of the total text.

Hybrid Wafer Scale Interconnection Flex Tape Package Connector Mount to Card

       Very large-scale integration (VLSI) devices can be
optimized with a hybrid wafer scale interconnection (HWSI) pack- age
interconnected to the system card with a flex tape and surface-mount
connector technique.

      As seen in Figs. 1 and 2, the VLSI chips 4 are flip-chip solder
interconnected to the thin film interconnection wafer 3.  The wafer
is solder-connected to a flex tape 5 and pluggably interconnected to
the system card 9 with a wire button or elastomeric connector 6.  The
interconnection wafer 3 is bonded to the heat sink 1 with a thermal
plastic adhesive 2.  The heat sink engages the flex tape 5 to the
wire button connector 6 and the system card 9. An insulator 8 is used
to protect the flex tape 5 during compression of the card.  The wire
button connectors 6 are housed in the cover 7 with eight location
points for attaching the cover/wirebutton connectors to the flex tape
and heat sink 1.

      In the configuration of Fig. 3, the cover provides mechanical
protection to the chip/wafer and the package is in an easy-to-handle
assembly for mounting to a tester board or system card.  The system
is further improved with HWSI/multichip package (MCP) pluggable
interconnection on one side and the thermal/mechanical attachment on
the op posite side of the module.  Four outside points locate and
compress the connectors to the card system or tester board. The wire
button...