Browse Prior Art Database

Modified Electrodeposited Polymer Coating for Enhanced Plating Adhesion

IP.com Disclosure Number: IPCOM000100122D
Original Publication Date: 1990-Mar-01
Included in the Prior Art Database: 2005-Mar-15
Document File: 1 page(s) / 54K

Publishing Venue

IBM

Related People

Imken, RL: AUTHOR

Abstract

Electrodeposited (ED) or electrophoretic polymer coatings are useful as dielectric sealants for anodized aluminum printed wiring boards using polymer thick film (PTF) pastes for conductor lines. As a means of increasing density of circuit lines and also conductivity of circuit lines, it is desirable to plate the electrodeposited coating. After the plating, photoimaging, and etching steps, a circuitized printed wiring board can be produced.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 58% of the total text.

Modified Electrodeposited Polymer Coating for Enhanced Plating Adhesion

       Electrodeposited (ED) or electrophoretic polymer coatings
are useful as dielectric sealants for anodized aluminum printed
wiring boards using polymer thick film (PTF) pastes for conductor
lines.  As a means of increasing density of circuit lines and also
conductivity of circuit lines, it is desirable to plate the
electrodeposited coating.  After the plating, photoimaging, and
etching steps, a circuitized printed wiring board can be produced.

      Since cured ED coatings may not provide the necessary surface
roughness to achieve good adhesion between the ED coating and
plating, a means of microetching the surface is necessary.  This
disclosure recommends mechanical blending or copolymerization to
introduce a small amount of polybutadiene into an ED polymer coating.
 The polybutadiene, due to its unsaturated chemical nature, is
susceptible to oxidation in acid etches, typically, chromic acid,
sulfuric acid, or a blend of the two.  This susceptibility can be
used to remove polybutadiene at the surface, introducing surface
roughness.  Once the desired degree of surface roughness is achieved,
the part can be plated using conventional electroless and
electrolytic techniques.  The roughness at the ED coating surface
serves to form mechnical interlocks between the plating and ED
coating.  Such susceptibility is routinely used to achieve good
plating adhesion in plated acrylonitrile-but...