Original Publication Date: 1990-Mar-01
Included in the Prior Art Database: 2005-Mar-15
Buehne, I: AUTHOR [+2]
This article describes a novel carrier for integrated semiconductor devices.
describes a novel carrier for integrated
carriers currently used are made up of individual
sheets. These sheets, into which a hole pattern is punched, are
provided with screen-printed vias and a conductor pattern. A
plurality of such sheets placed on top of each other and then fired
yield a ceramic carrier.
process described in this article, punching or drilling
of the individual carrier layers is eliminated. The carrier, thus
produced, has solid metallic vias in the form of a hole pattern.
Several conductor planes are not required. The carrier may be made
of a variety of materials, such as glass, plastics or metal.
the diameters of the desired chip contacts and
vias as well as the module pins, which may all have different
diameters, are molded parallel to each other in a carrier substrate.
For a metallic carrier substrate, insulated wires must be used.
After the molding compound has solidified, an elongated block is
obtained, inside of which the wires are molded parallel to the
block's center axis.
of this block, cut off perpendicular to its center
axis, have vias and contact areas for chip contacting and for
accommodating the module pins.
contacts are obtained by the remainder of the parallel
molded wires contained in each slice.
The conductor pattern may be applied by providing the surfac...