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Chip Integrated Cooling System

IP.com Disclosure Number: IPCOM000100208D
Original Publication Date: 1990-Mar-01
Included in the Prior Art Database: 2005-Mar-15
Document File: 2 page(s) / 64K

Publishing Venue

IBM

Related People

Landrock, J: AUTHOR [+3]

Abstract

This cooling system prevents local temperature peaks on semiconductor chips and improves the effectiveness of external cooling. Its concept is to provide a chip, in addition to standard electric circuits, which are produced by known methods, with piezoelectric crystals and pipes. As a result, the chip is convection cooled, with piezoelectric pressure feeding the cooling medium through the pipes.

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Chip Integrated Cooling System

       This cooling system prevents local temperature peaks on
semiconductor chips and improves the effectiveness of external
cooling.  Its concept is to provide a chip, in addition to standard
electric circuits, which are produced by known methods, with
piezoelectric crystals and pipes.  As a result, the chip is
convection cooled, with piezoelectric pressure feeding the cooling
medium through the pipes.

      The enormous heat developing in integrated circuits frequently
necessitates elaborate cooling systems.  One of the most effective
systems used for this purpose comprises, for example, copper bolts
which rest directly on the chip surface to thermally contact external
cooling means.  A less elaborate system operates such that the air
space between chip and housing is filled with a thermally conductive
grease.

      These and other systems serve to prevent critical temperatures.
 However, as there is no uniform heat development, and the chip's
material (silicon) is a very poor heat conductor, local temperature
peaks may occur, leading to failure of electronic components.

      Therefore, it is desirable to have a more reliable chip and/or
to reduce the amount of conventional cooling means required.  This is
achieved by convection cooling within the material, which
substantially boosts the thermal conductivity.

      The cooling system comprises a pipe structure K1 to K5 and
piezoelectric crystals P1 to P4 on a...