Original Publication Date: 1990-Mar-01
Included in the Prior Art Database: 2005-Mar-15
Blum, A: AUTHOR [+3]
This article describes a silicon wafer interconnector based on liquid contacting and affording low-impedance high-density interconnections with additional cooling capabilities.
describes a silicon wafer interconnector
based on liquid contacting and affording low-impedance high-density
interconnections with additional cooling capabilities.
An example of
the new interconnector is shown in the figure.
Silicon wiring wafers 1, which are coated with metal lines 2 and on
which integrated circuits (not shown) may be mounted, are
interconnected by connector wafers 3 preferably made of silicon. On
top of such a stack, a top connector 4 is provided and at the bottom
a cooling block 5.
interconnection signals are transferred on conductors
comprising an electrically conducting liquid 10 pumped through pipes
formed by holes 11 in the wiring wafers 1, tubes 12 in the connector
wafers 3 and bores 13 in top connector 4 and cooling block 5.
Miniature pumps 14 circulate the conducting liquid 10 through the
pipes, cooling wiring wafers 1 and any circuits on top of them. The
heat is fed to cooling block 5 which is cooled by a flow of cooling
Holes 11 in
wiring wafers 1 as well as tubes 12 are fabricated
by silicon etching as used in micromechanics. The outer ends of holes
11 and tubes 12 are conically shaped, so that the tube ends fit the
holes 11. As a result of the mechanical elasticity of thin silicon
structures, the pipes are tight despite small tolerances, misfit and
thermal expansion. The pipes can be disassembled for
reconfiguration, repair or extension, thus prov...