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Browse Prior Art Database

Single Chip Module for VLSI (CMOS) Technology - High Performance

IP.com Disclosure Number: IPCOM000100249D
Original Publication Date: 1990-Mar-01
Included in the Prior Art Database: 2005-Mar-15
Document File: 2 page(s) / 64K

Publishing Venue

IBM

Related People

Braen, RC: AUTHOR

Abstract

The proposed SCM (Single Chip Module) has three main elements (see Fig. 1 - Side View).

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 59% of the total text.

Single Chip Module for VLSI (CMOS) Technology - High Performance

       The proposed SCM (Single Chip Module) has three main
elements (see Fig.  1 - Side View).

      Element 1 - Heat sink CAP and chip mounting detail. The CAP is
made from a ceramic or glass ceramic material which may contain a
metallic "Heat Spreader" element with coefficient of thermal
expansion matching the ceramic material.  The VLSI chip is "Back
Mounted" to this CAP by euthermic or similar method to provide an
efficient thermal interface.  The optional "Heat Spreader" may be
required to further enhance the CAP's thermal characteristics.  The
surface of the CAP can have heat dissipating elements, such as slots,
V grooves, pins, micro grooves or other surface details, for
efficient heat transfer to a cooling media such as air.  A smooth
surface could also be provided for direct attachment to a cold plate
thermal heat sink.

      Element 2 - Printed Circuit (PC) Decal.  A two-sided PC decal
made from a one- or two-mil polymide material.  The circuit pattern
would be developed in normal PC methods with a pattern matching the
C4 pattern on the edge of the decal. Using two-sided circuitry gives
the application design options on placing power and ground on one
side and signal on the other, or a mix of signal and power on both
sides of the decal, depending on a mix or signal and power on both
sides of the decal, depending on the electrical characteristics
desired. Mounting the decoupling...