Browse Prior Art Database

Compliant Thermode for Surface Solder

IP.com Disclosure Number: IPCOM000100298D
Original Publication Date: 1990-Mar-01
Included in the Prior Art Database: 2005-Mar-15
Document File: 2 page(s) / 47K

Publishing Venue

IBM

Related People

Kohn, H: AUTHOR [+2]

Abstract

Disclosed is a device for attaching by solder reflow, a surface solder component, such as flex film or any other multipad component, to a substrate surface where surface irregularity is a major factor that must be overcome for a 100% solder joint reflow process.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

Compliant Thermode for Surface Solder

       Disclosed is a device for attaching by solder reflow, a
surface solder component, such as flex film or any other multipad
component, to a substrate surface where surface irregularity is a
major factor that must be overcome for a 100% solder joint reflow
process.

      An aluminum housing 1 contains a cartridge heater 2 (see Fig.
1), which when heated conducts heat to pins 3 (see Fig. 2).  The pins
are free to move in the Z axis in the lower housing 4.  The pins
are held down by silicone slugs (springs) 5 which allow Z axis
movement of the pins.  When the housing is lowered to a surface mount
component, such as flex film 6 on a substrate with an irregular
surface 7, the pins can move in a Z axis to comply to the
irregularity of the surface, and at the same time conduct heat to the
flex and solder on the substrate.  The solder reflows and then
cooling air is flowed through the chambers 8 (Fig. 1) in the housing
to cool and freeze the solder joint before the housing is withdrawn,
leaving a component soldered to the irregular surface of the
substrate.