Browse Prior Art Database

Direct Chip Bonding Using Transferred Conductive Adhesive Film

IP.com Disclosure Number: IPCOM000100307D
Original Publication Date: 1990-Mar-01
Included in the Prior Art Database: 2005-Mar-15
Document File: 2 page(s) / 45K

Publishing Venue

IBM

Related People

Sakamoto, K: AUTHOR [+2]

Abstract

Disclosed is an interconnection method using a transferred conductive adhesive (TCA) film, which enables low-cost and high-density face-down chip bonding on a metalized substrate like a liquid crystal display (LCD) glass panel.

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Direct Chip Bonding Using Transferred Conductive Adhesive Film

       Disclosed is an interconnection method using a
transferred conductive adhesive (TCA) film, which enables low-cost
and high-density face-down chip bonding on a metalized substrate like
a liquid crystal display (LCD) glass panel.

      The interconnection method disclosed herein is as follows.
Fig. 1 shows a structure of a TCA film.  The TCA film consists of
highly distributed nickel particles and an adhesive in sol stage.  A
preheated bumped chip is handled by a mechanical tool and is
contacted with the TCA film. The film in the contacted area is
transferred to the bump since organic solvent at the heated area will
vaporize by heat and the film will become tacky.

      On a metalized substrate, an adhesive film is placed before
bonding.  The adhesive film may be either thermo-setting or thermo-
plastic type (Fig. 2).

      Then the chip with the TCA film is aligned with electrodes on
the substrate and bonded to the substrate by heat and pressure.  An
electrical connection is made through the nickel particles in the TCA
film and mechanical adhesion is achieved by the adhesive film
formerly placed on the substrate (Fig. 3).

      By this method, many particles can work as connecting agents
per a bump which results in highly reliable interconnection.  Also
this method is very inexpensive, since no expensive materials or
process tools are required.