Browse Prior Art Database

Universal Hat

IP.com Disclosure Number: IPCOM000100317D
Original Publication Date: 1990-Apr-01
Included in the Prior Art Database: 2005-Mar-15
Document File: 1 page(s) / 55K

Publishing Venue

IBM

Related People

Mack, GH: AUTHOR [+2]

Abstract

Disclosed is a device used to transfer heat from silicon chips on a substrate to a cooling medium, such as a cold plate. The unique feature is its ability to contact all chips within the confines of the area covered regardless of chip layout, density or pitch.

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This is the abbreviated version, containing approximately 100% of the total text.

Universal Hat

       Disclosed is a device used to transfer heat from silicon
chips on a substrate to a cooling medium, such as a cold plate.  The
unique feature is its ability to contact all chips within the
confines of the area covered regardless of chip layout, density or
pitch.

      This cooling device uses the "bed of nails" principle where the
pressure of a rectangular object, larger than the diameter of one of
the pistons, applied to the pin array will result in adequate surface
contact to transfer heat from the object to the pin holder.  The
close proximity of the pistons in addition to their small size makes
this possible.  A small spring behind each piston provides the
necessary force to assure good surface contact while allowing
compliance for variations in chip height and/or non-parallelism.