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Turbulator/Heat Sink - A Dual-Purpose Cooling Fin to Thermally Enhance Densely Populated Power Circuit Cards

IP.com Disclosure Number: IPCOM000100341D
Original Publication Date: 1990-Apr-01
Included in the Prior Art Database: 2005-Mar-15
Document File: 2 page(s) / 47K

Publishing Venue

IBM

Related People

Campo, W: AUTHOR [+4]

Abstract

Disclosed is a thermally conductive heat sink and air turbulator 1 that is soldered into PIH (pin in hole) 2, copper base plate of the power printed circuit card.

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Turbulator/Heat Sink - A Dual-Purpose Cooling Fin to Thermally Enhance Densely Populated Power Circuit Cards

       Disclosed is a thermally conductive heat sink and air
turbulator 1 that is soldered into PIH (pin in hole) 2, copper base
plate of the power printed circuit card.

      The device straddles the circuit lines 3, causing less
obstructions to circuit density than conventional surface-mounted
heat sinks.

      Heat generated by the power chip is transferred to the copper
base plate and on into the legs of this device that acts as a heat
sink drawing off heat by conduction from the circuit card base plate
4.

      Additional cooling is caused as uniform air flow from the
cooling fans is disrupted creating air turbulence off the trailing
edge of this device.  This turbulent air scatters the insulating
thermal laminar boundary layer on the circuit card surface, further
cooling the circuit card 5.

      Location and quantity of holes 6 may vary to further enhance
cooling.