Browse Prior Art Database

Quadtab: A Technique for the Simplification And Enhancement Of TAB

IP.com Disclosure Number: IPCOM000100423D
Original Publication Date: 1990-Apr-01
Included in the Prior Art Database: 2005-Mar-15
Document File: 2 page(s) / 81K

Publishing Venue

IBM

Related People

Honeycutt, JO: AUTHOR [+5]

Abstract

A Tape Automated Bonding (TAB) tape family is shown (Fig. 1) that speeds up and simplifies TAB production and assembly. It eliminates the blind bonding of tape leads to chips (Fig. 2). The family of tapes disclosed breaks the TAB part into four quadrants (QUADTAB) that are predefined with various pad pitches for inner and outer lead bonds as well as I/O capability ranges. A specific family of TAB is bonded, one to each side of the silicon chip. The net result is the use of four fairly simple single-sided TABs to effectively form a large, traditionally complex four-sided TAB format. The QUADTABs can be customized prior to assembly through a laser deletion of unused bond pads.

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Quadtab: A Technique for the Simplification And Enhancement Of TAB

       A Tape Automated Bonding (TAB) tape family is shown (Fig.
1) that speeds up and simplifies TAB production and assembly. It
eliminates the blind bonding of tape leads to chips (Fig. 2).  The
family of tapes disclosed breaks the TAB part into four quadrants
(QUADTAB) that are predefined with various pad pitches for inner and
outer lead bonds as well as I/O capability ranges.  A specific family
of TAB is bonded, one to each side of the silicon chip.  The net
result is the use of four fairly simple single-sided TABs to
effectively form a large, traditionally complex four-sided TAB
format.  The QUADTABs can be customized prior to assembly through a
laser deletion of unused bond pads.  The end result is a simplified
TAB production and assembly that can encompass traditionally complex
TAB format and assembly without sacrificing function.