Dismiss
InnovationQ will be updated on Sunday, Oct. 22, from 10am ET - noon. You may experience brief service interruptions during that time.
Browse Prior Art Database

Solution Conformal Coating Method for Electrically Isolated Via Fabrication

IP.com Disclosure Number: IPCOM000100441D
Original Publication Date: 1990-Apr-01
Included in the Prior Art Database: 2005-Mar-15
Document File: 1 page(s) / 30K

Publishing Venue

IBM

Related People

Buchwalter, SL: AUTHOR [+5]

Abstract

Disclosed is a method for providing a dielectric coating on the sidewall of a through-hole in a substrate. The conformal solution application of polymeric material to the sidewall of the through-hole creates an insulated cavity which may be subsequently metallized to form a via.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

Solution Conformal Coating Method for Electrically Isolated Via Fabrication

       Disclosed is a method for providing a dielectric coating
on the sidewall of a through-hole in a substrate.  The conformal
solution application of polymeric material to the sidewall of the
through-hole creates an insulated cavity which may be subsequently
metallized to form a via.

      A substrate with through-holes is mounted in a flow through
apparatus as shown in the figure.  With the substrate serving as a
gasket between the two halves of the apparatus, polymer solution is
introduced through valves 1 and 2.  After application of the polymer
solution, the use of pressurized nitrogen gas to push the solution
through the hole, or the use of vacuum to pull the solution through
the hole, may be employed to achieve conformal coating.

      Upon coating of the interior wall of the through-hole, a
continuous flow of nitrogen gas through the vias assures that they
will remain open during the thermal cycle required to dry and cure
the polymeric material.