Browse Prior Art Database

Tab Laser Carrier Assembly

IP.com Disclosure Number: IPCOM000100455D
Original Publication Date: 1990-Apr-01
Included in the Prior Art Database: 2005-Mar-15
Document File: 3 page(s) / 117K

Publishing Venue

IBM

Related People

Kapur, KN: AUTHOR [+3]

Abstract

The carrier described here can be used in a higher level assembly, such as a hermetically sealable ceramic optoelectronic package. This disclosure presents an assembly method using an extension of the TAB (Tape Automated Bonding) technology.

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Tab Laser Carrier Assembly

       The carrier described here can be used in a higher level
assembly, such as a hermetically sealable ceramic optoelectronic
package.  This disclosure presents an assembly method using an
extension of the TAB (Tape Automated Bonding) technology.

      The laser carrier itself is a large silicon chip which contains
metallized circuitry, wire bond pads for the laser and photodiode,
anisotropically etched V-grooves to align the fibers, and bumped pads
to join to a TAB tape (see Figs 1A and 1B).

      The laser array chips are small, about 4-8 mils in height, 5-10
mils wide, approximately 40 mils in length. Present technology uses a
common connection on the backside, and wire bond pads on the top.
Advances in chip technology will eventually lead to an all planar
structure which will be suitable for C4 mount.  The laser radiation
is monitored with a photodiode for each channel.  This small chip is
also placed near the laser array and wire bonded in place.

      To assemble the carrier, the following sequence takes place:
   1.   The silicon laser carrier is TAB bonded to the TAB tape in
reel using conventional technology.
      2.   A reel-driven placement machine is used to locate and
place the laser and photodiode chips, and any other discrete
components as required.  Either solder or suitable conductive chip
bonding adhesive is used.  The structure will be exposed later to
wave-soldering conditions, or seal-so...