Browse Prior Art Database

Matched Impedance Plane-to-plane Connection

IP.com Disclosure Number: IPCOM000100461D
Original Publication Date: 1990-Apr-01
Included in the Prior Art Database: 2005-Mar-15
Document File: 2 page(s) / 63K

Publishing Venue

IBM

Related People

Chang, CS: AUTHOR [+3]

Abstract

Disclosed is a method for providing controlled characteristic impedance conductors in a direction perpendicular to the plane of a circuit board. This feature is required for boards having very high performance characteristics and of substantial thickness, or where two such high performance boards must be connected together to form a thicker board. The desired characteristics are achieved by providing either "twin-lead" or a "coaxial-cable" to carry signals through the board. Twin-Lead

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Matched Impedance Plane-to-plane Connection

       Disclosed is a method for providing controlled
characteristic impedance conductors in a direction perpendicular to
the plane of a circuit board.  This feature is required for boards
having very high performance characteristics and of substantial
thickness, or where two such high performance boards must be
connected together to form a thicker board.  The desired
characteristics are achieved by providing either "twin-lead" or a
"coaxial-cable" to carry signals through the board. Twin-Lead

      Two holes are drilled and plated through the power distribution
board (Fig. 1).  There are no connections to the power planes.  The
power board is then fastened between the two high density boards
using a "Joining Technology" (not shown) which connects the two holes
(Fig. 2).  One hole is a signal conductor, and the other is a ground
reference, thus forming a controlled impedance twin-lead.  The power
planes are connected at the same time as the twin-leads by the same
means, only a single operation being required. Coaxial

      A hole is first drilled through the power plane and plated
through.  This hole is then filled, drilled and plated through with a
smaller hole (Fig. 3).  It is anticipated that it will be necessary
to grind or otherwise remove the land from the first hole to provide
a flat surface for the second circuitization.  This provides a
coaxial cable which may be assembled in the same manner as the...