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Browse Prior Art Database

Fiber-Optic Interface for Opto-Electronic Modules

IP.com Disclosure Number: IPCOM000100562D
Original Publication Date: 1990-May-01
Included in the Prior Art Database: 2005-Mar-15
Document File: 2 page(s) / 76K

Publishing Venue

IBM

Related People

Donner, EO: AUTHOR [+5]

Abstract

Proposed is an optical interface between optical fibers and Opto-Electronic (OE) Devices which are mounted on a substrate inside a hermetically sealed module.

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This is the abbreviated version, containing approximately 58% of the total text.

Fiber-Optic Interface for Opto-Electronic Modules

       Proposed is an optical interface between optical fibers
and Opto-Electronic (OE) Devices which are mounted on a substrate
inside a hermetically sealed module.

      A typical high performance computer package consists, in part,
of a hermetically sealed module which contains microelectronic chips,
an electical wiring substrate, cooling structures and/or fluids, and
a cover (or hat). These devices and structures are typically
assembled together with mechanical precision and tolerances on the
order of one thousandth of an inch.  The introduction of fiber optics
into such an environment is not straightforward (*). Fiber optics
assembly (i.e., alignment) tolerances can be an order of magnitude
more critical and the optical path must be free of any possible
contaminants. A method for introducing fiber optics into a computer
module is illustrated in the figure.

      An opto-electronic chip, either a photodiode or
surface-emitting LED with its associated electronic circuits, is
bonded face up on the substrate of the module, using an appropriate
bonding technique. A gel, elastomer or deformable plastic, which has
a well-defined index of refraction and is transparent at the
operating wavelength, fills the space between the opto-electronic
chip and a lens. This material is used to prevent the contaminants
from crossing the optical path between the chip and lens. The
deformable or elastic nature of the filler is...