Browse Prior Art Database

Gigabit Opto-Electronic Package Using Extended Mcp Substrate

IP.com Disclosure Number: IPCOM000100569D
Original Publication Date: 1990-May-01
Included in the Prior Art Database: 2005-Mar-15
Document File: 3 page(s) / 101K

Publishing Venue

IBM

Related People

Kapur, KN: AUTHOR [+3]

Abstract

A high-frequency fiber-optic package is described which uses an extended ceramic chip carrier. It has a higher electrical performance than conventional packages and is suited for Gigabit data rates. It includes three levels of metal, a thin film capacitor integrated between two wiring levels, and pad-on-pad connectors to flex cable for the Gigabit wiring.

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Gigabit Opto-Electronic Package Using Extended Mcp Substrate

       A high-frequency fiber-optic package is described which
uses an extended ceramic chip carrier.  It has a higher electrical
performance than conventional packages and is suited for Gigabit data
rates.  It includes three levels of metal, a thin film capacitor
integrated between two wiring levels, and pad-on-pad connectors to
flex cable for the Gigabit wiring.

      Fig. 1 shows only the fiber-optic transmitter module. An
analogous package (not shown) would be designed for the fiber-optic
receiver application which uses photodiodes to detect the digital
data from the incoming fiber.  Other modules, such as a cross-point
switch module which handles electrical Gigabit signals, but no
optical signals, would be constructed with the same technology.

      Fig. 2 shows how the modules would be used in a system
cross-point switch application.  Gigabit wiring between modules would
be on stripline or triplate wiring on flex cabling.  The planar board
would be of conventional design.

      The module would be either a conventional alumina ceramic, or
AIN ceramic if enhanced thermal performance is needed.  The Si or
GaAs chip would be C4 bonded.  The pins shown are to be used for
power and ground connections and for low frequency signals.  Gigabit
signals would be made by pad-on-pad connections between pads on the
edge of the substrate and pads on the flex cable.  Pad-on-pad
connectors are us...