Browse Prior Art Database

Line And Via Interconnect Structure Using a Single Mask

IP.com Disclosure Number: IPCOM000100579D
Original Publication Date: 1990-May-01
Included in the Prior Art Database: 2005-Mar-15
Document File: 2 page(s) / 105K

Publishing Venue

IBM

Related People

Cronin, J: AUTHOR [+3]

Abstract

A local interconnect structure is fabricated using a single mask step. The process uses chemical vapor deposited (CVD) resist, angled exposures and multiple insulators to interconnect one wiring level to another, i.e., the contact level.

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Line And Via Interconnect Structure Using a Single Mask

       A local interconnect structure is fabricated using a
single mask step.  The process uses chemical vapor deposited (CVD)
resist, angled exposures and multiple insulators to interconnect one
wiring level to another, i.e., the contact level.

      Referring to Fig. 1, a general wiring methodology, except for
certain limitations, is shown which basically eliminates a mask step
normally used. After a general conductor level is defined on a
semiconductor substrate, a suitable insulator (CVD oxide in this
embodiment) is deposited over the wiring level, planarized, masked
and etched to define a wiring pattern.
Shape #1 is a much thicker line than is normally used, which is a
minimum feature. This shape cannot run over the first conductor
wiring level without contacting it.
Shape #2 allows wiring interconnection between the first and second
level of conductors. The interconnection between levels occurs only
at the "ends" of the oxide shape; therefore, an interconnection is
made by simply ending the line. Using shapes #1 and #2 together
allows a general wiring conductor whose vias occur where there is a
minimum feature, i.e., the CVD resist completely filling.
Shape #3 is a conductive strap for the first level conductor. This
shape ends up as a large surface area conductor for high frequency or
waveguide applications.
Shape #4 is a general wiring level on the second conductor level and
has the slight disadvanta...