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Method for a sunken PCB surface for embedded component assembly

IP.com Disclosure Number: IPCOM000100594D
Publication Date: 2005-Mar-15
Document File: 5 page(s) / 63K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a sunken printed circuit board (PCB) surface for embedded component assembly. Benefits include improved functionality and improved reliability.

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Method for a sunken PCB surface for embedded component assembly

Disclosed is a method for a sunken printed circuit board (PCB) surface for embedded component assembly. Benefits include improved functionality and improved reliability.

Background

              Conventionally, several problems can occur during manufacturing and test. Tall components

on PCBs become the objects that block access for the probing blocks of automated board-testing equipment. The conventional solution places the component on top of the PCB. Solder joints are susceptible to cracking due to board warpage.

              In some cases, height is an issue for system assembly and testing. More vertical spacing is required for tall components in the product enclosure or chassis design. Clearance is required between tall components and the connectors/test points.

              Components can be misaligned during placement. Small components can be knocked off the PCB surface in the handling process. Thicker product enclosures are required for PCBs with tall components as compared to low-profile components.

      Components are designed to resist board flexing after assembly on the PCB. Stringent strain requirements are needed to ensure that board assembly and the testing process ensure flexing is within the confined range.

      Chip or component placement equipment must have good control for bigger size components.

General description

      The disclosed method is a sunken PCB surface for embedded component assembly.

              The key elements of the method include:

•             Low profile PCB assembly solution

•             PCB surface that is sunken for mounting active or passive components

•             Sunken surface that forms any shape of hole and dimension based on the embedded component footprint

•             Component that can be partially sunken into the PCB or fully sunken in to the PCB

Advantages

              The disclosed method provides advantages, including:

•             Improved functionality due to reducing the overall PCB assembly height and enabling the design of low-profile assembly solutions

•             Improved functionality due to enabling automated test probes to access the test point on the board because of reduced assembly height

•             Improved functionality due to enabling one-piece heatsink design for heat dissipation of many components because all components stay flat against the PCB surface when they are embedded in the PCB

•             Impr...