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Method for a BGA assembly option for mobile processors

IP.com Disclosure Number: IPCOM000100597D
Publication Date: 2005-Mar-15
Document File: 3 page(s) / 58K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a ball grid array (BGA) assembly option for mobile processors. Benefits include improved functionality and improved performance.

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Method for a BGA assembly option for mobile processors

Disclosed is a method for a ball grid array (BGA) assembly option for mobile processors. Benefits include improved functionality and improved performance.

Background

      Capacitor thickness reduction is required to accommodate package designs with reduced total package height. Land-side capacitors (LSCs) are being explored as an option for mobile packages power delivery to replace die-side capacitors (DSCs). Substrates with LSCs enable lower substrate layer count and lower cost substrates. Additionally, mechanical interaction with LSC packages and the motherboard is eliminated.

      Conventionally, capacitor thickness is reduced by using thin profile capacitors,  0.5 mm +/- 0.1-mm thick, which is an improvement over the previous 0.85 mm +/- 0.1-mm (see Figure 1).

General description

      The disclosed method is an assembly option for mobile processors to eliminate height constraints and increase power delivery alternatives.

              The key element of the method includes creating a through-hole below the die shadow area in the motherboard to eliminate package height constraints. A recessed area is a viable alternative.

Advantages

              The disclosed method provides advantages, including:

•             Improved functionality due to enabling higher capacitance, thicker profile (0.85 mm +/- 0.1 mm) capacitors to be used for pin grid array (PGA) packages as LSC for mobile packages solutions

•          ...