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Browse Prior Art Database

Direct Lead Attachment Technology

IP.com Disclosure Number: IPCOM000100619D
Original Publication Date: 1990-May-01
Included in the Prior Art Database: 2005-Mar-15
Document File: 2 page(s) / 46K

Publishing Venue

IBM

Related People

Noth, R: AUTHOR [+2]

Abstract

A lead attachment alternative is shown for memory array tabs which takes advantage of the structural superiority of tape automated bonding (TAB) while providing a simpler and unique inner lead connection.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 92% of the total text.

Direct Lead Attachment Technology

       A lead attachment alternative is shown for memory array
tabs which takes advantage of the structural superiority of tape
automated bonding (TAB) while providing a simpler and unique inner
lead connection.

      Referring to Figs. 1 and 2, the packaging structure shown
contains a silicon device or a ceramic substrate with a patterned
adhesive layer, a patterned polymer layer and a conductive layer. A
connection between the conductor layer and substrate or silicon
device can be achieved by any of the following methods:
           A.  Reflow ball     (Fig. 1)
           B.  Sputter         (Fig. 2)
           C.  Pattern plated  (Fig. 2)
           D.  Evaporation     (Fig. 2)

      Package layers can be put together, pre-punched or blank, and
pattern etched after lamination. This package technique allows the
chip connections to be performed at the terminal stage and offers the
following advantages:
   A.  No bump is needed like TAB.
   B.  No lead frame is needed like wire bond
      packages.
   C.  No wire bond process or TAB thermocompression
       inner lead bonding needed.
   D.  Allows tight ground rules like TAB.
   E.  The technique can be applied to a substrate or
       directly to a silicon device.
   F.  Provides chip-up or chip-down option.
   G.  Provides area-wiring capabilities.
   H.  Provides multi-lay...