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Method for using epoxy material for surface mounting BGAs to PCBs

IP.com Disclosure Number: IPCOM000100629D
Publication Date: 2005-Mar-15
Document File: 2 page(s) / 108K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for using epoxy material for surface mounting ball grid arrays (BGAs) to printed circuit boards (PCB). Benefits include improved functionality.

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Method for using epoxy material for surface mounting BGAs to PCBs

Disclosed is a method for using epoxy material for surface mounting ball grid arrays (BGAs) to printed circuit boards (PCB). Benefits include improved functionality.

Background

      When land-side capacitors were used to reduce package layer count, stresses caused the solder joints to crack during shock, vibration, temperature cycling. Damage occurred to the land-side capacitors and failure resulted. No solution exists conventionally, and the use of land-side capacitors to reduce the package layer count has been abandoned. However, polymer/epoxy material is successfully used with BGA solder joints of packages that do not have land-side capacitors (see Figure 1).

General description

      The disclosed method uses polymer/epoxy material to protect the solder joints of land-side capacitors after a BGA is surface mounted to a PCB.

              The key elements of the method include:

•             Land-side capacitors on the component being surface mounted to the PCB

•             Epoxy/polymer material between the capacitors and/or solder balls

Advantages

              The disclosed method provides advantages, including:

•             Improved functionality due to enabling land-side capacitors to be used to reduce package layer count without adverse affects on reliability

Detailed description

      The disclosed method includes the use of solder paste or soldering flux material to PCB lands (see Figure 2)...