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Thermocouple Probe Fixture and Metrology for Junction-to-Sink and Case-to-Sink Thermal Resistance Measurement

IP.com Disclosure Number: IPCOM000100719D
Publication Date: 2005-Mar-16
Document File: 2 page(s) / 157K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for measuring the temperature of a heat sink and IHS using a thermocouple probe. Benefits include a solution that is highly accurate and reduces manufacturing costs.

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Thermocouple Probe Fixture and Metrology for Junction-to-Sink and Case-to-Sink Thermal Resistance Measurement

Disclosed is a method for measuring the temperature of a heat sink and IHS using a thermocouple probe. Benefits include a solution that is highly accurate and reduces manufacturing costs.

Background

Currently, a wire thermocouple is permanently attached to a heat sink or on the top surface of an IHS to measure temperatures (the thermocouple can be difficult to attach to certain heat sink geometries). However, the wire thermocouple has a tendency to detach from the heat sink or IHS during handling or environmental stressing. Also, the accuracy of the thermocouple is highly dependant on the operator. Figure 1 shows the current state of the art.

General Description

The disclosed method consists of two thermocouple probes mounted on a translation stage that can move in all directions. A constant force spring enables the thermocouple probes to apply and maintain a constant force on the measurement surface. It also enables the probes to be withdrawn and secured while test boards are being changed. The test board with the heat sink is mounted on a Lexan platform and is secured in place by the cooling duct. An open loop fan provides the airflow to cool the heat sink. The underside of the platform, where the test board is mounted, is insulated with foam to minimize heat loss. The entire fixture is mounted on a 23.75” by 14” aluminum base plate (see Figure 2).

Advantages

T...