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Browse Prior Art Database

Spot Plating Tool for Thin Film Circuit Repair

IP.com Disclosure Number: IPCOM000100739D
Original Publication Date: 1990-May-01
Included in the Prior Art Database: 2005-Mar-16
Document File: 2 page(s) / 69K

Publishing Venue

IBM

Related People

Sambucetti, CJ: AUTHOR [+2]

Abstract

This article describes an electrochemical device which functions as a spot-plating or etching tool which can be used for the repair of defects (opens and shorts) in printed circuit lines. A schematic drawing of this self-contained plating system is shown in the figure. The apparatus contains a microcapillary tip for providing in a controlled manner electrolyte solution in the form of a droplet to a defect area to be repaired. The amount of solution maintained at the microcapillary tip is controlled with pressure to ensure electrolytic connection between the defect area and the counterelectrode (copper wire) housed in the upper chamber of the pipette above the microcapillary. With pressure control, the droplet can be delivered and retracted from the tip.

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Spot Plating Tool for Thin Film Circuit Repair

       This article describes an electrochemical device which
functions as a spot-plating or etching tool which can be used for the
repair of defects (opens and shorts) in printed circuit lines.  A
schematic drawing of this self-contained plating system is shown in
the figure.  The apparatus contains a microcapillary tip for
providing in a controlled manner electrolyte solution in the form of
a droplet to a defect area to be repaired.  The amount of solution
maintained at the microcapillary tip is controlled with pressure to
ensure electrolytic connection between the defect area and the
counterelectrode (copper wire) housed in the upper chamber of the
pipette above the microcapillary. With pressure control, the droplet
can be delivered and retracted from the tip.  To repair an open in a
Cu line, the counterelectrode is made anodic while the lines to be
bridged are made cathodic using an appro priate power supply,
battery, or potentiostat to control the applied bias.  Operation of
the device as an etching tool to remove shorts between lines the
counter electrode is cathodically biased while the region to be
etched is anodic.

      Principle In the case of copper metal plating or etching, the
following well-known electrochemical reactions are exploited:
                             anodic
                     Cuo              Cu(+2) + 2e-
        ...