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Device to Hold Substrates During a Sputtering Process

IP.com Disclosure Number: IPCOM000100749D
Original Publication Date: 1990-Jun-01
Included in the Prior Art Database: 2005-Mar-16
Document File: 3 page(s) / 62K

Publishing Venue

IBM

Related People

Kruger, BP: AUTHOR

Abstract

Described is a design used to hold rigid memory disks during the sputtering process. This design allows the disk to be held vertically and sputtered on both sides simultaneously. Important features of this design are: - Easy load/unloading - Eliminates any contact of critical areas of the disk (data surfaces) - Reduces secondary plasmas from entering the opposite sides of the disk around its perimeter - Allows sputtering of the entire surface of the disk (reduces shadow)

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Device to Hold Substrates During a Sputtering Process

       Described is a design used to hold rigid memory disks
during the sputtering process.  This design allows the disk to be
held vertically and sputtered on both sides simultaneously. Important
features of this design are:
      -    Easy load/unloading
      -    Eliminates any contact of critical areas of the
           disk (data surfaces)
      -    Reduces secondary plasmas from entering the
           opposite sides of the disk around its perimeter
      -    Allows sputtering of the entire surface of the
           disk (reduces shadow)

      Fig. 1 illustrates disk 1 sitting in groove 4 which has been
machined from radius R1.  Radius R2 is offset vertically from radius
R1, which is where contour 3 is machined in pallet 2.  Loading disk 1
into pallet 2 is achieved by entering disk 1 into the area in front
of contour 3 and lowering it into groove 4.

      Fig. 2 illustrates a cross-section of pallet 2 and disk 1.
Note that only the chamfer 9 of disk 1 can contact pallet 2 during
the load process because of contour 3.

      Fig. 3 illustrates an enlarged view of groove 4. Important
features shown in this view include angle 8 which holds the disk in a
vertical position and angle 7 which guides the disk to angle 8 and
allows sputtering to reach the chamfer 9 of the disk.  Lip 5 on
contour 3 eliminates the plasma from crossing to t...