Browse Prior Art Database

Low Temperature Computer Package With Multiple Thermal Zones

IP.com Disclosure Number: IPCOM000100850D
Original Publication Date: 1990-Jun-01
Included in the Prior Art Database: 2005-Mar-16
Document File: 2 page(s) / 72K

Publishing Venue

IBM

Related People

Blake, BE: AUTHOR [+4]

Abstract

Disclosed is a computer packaging system which takes advantage of operating CMOS devices at low temperature, maintains the optimum cooling for different parts of the system, and enables close coupling of the main memory to the central processing unit (CPU) by integrating the cooling unit with the electronics mounting structure. This enables the memory to operate at a higher temperature than the CPU, maintaining system power efficiency, yet allowing a degree of enhanced memory performance.

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Low Temperature Computer Package With Multiple Thermal Zones

       Disclosed is a computer packaging system which takes
advantage of operating CMOS devices at low temperature, maintains the
optimum cooling for different parts of the system, and enables close
coupling of the main memory to the central processing unit (CPU) by
integrating the cooling unit with the electronics mounting structure.
This enables the memory to operate at a higher temperature than the
CPU, maintaining system power efficiency, yet allowing a degree of
enhanced memory performance.

      The theoretical coefficient of performance of a cooling system
is equal to Tc/(Th - Tc), where Th = temperature at which heat is to
be rejected (typically, room temperature of approximately 300oK) and
Tc = temperature to which device is to be cooled.  The CPU would
typically be cooled to 77oK, the boiling point of liquid nitrogen,
resulting in a theoretical coefficient of performance of 77/(300 -
77) = 0.34.  The main memory can be cooled at a somewhat higher
temperature, 150oK, for example, still resulting in enhanced
performance but having a greatly increased coefficient of performance
of 150/(300 - 150) = 1.0.  Cryocoolers which have two stages of
cooling to two different temperatures are commercially available.

      Fig. 1 shows a configuration in which the cold end of a
cryocooler accepts electronic devices for direct attachment mounting,
thereby providing a good conduction cooling path. The C...