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Gas Jet Manifold for Module Cooling in Belt-Type Chip-Joining Furnaces

IP.com Disclosure Number: IPCOM000100871D
Original Publication Date: 1990-Jun-01
Included in the Prior Art Database: 2005-Mar-16
Document File: 1 page(s) / 44K

Publishing Venue

IBM

Related People

Fischer, GF: AUTHOR [+2]

Abstract

Semiconductor chips are attached to a substrate by the conventional soldering process in which a chip-substrate module is placed on a belt that passes through a furnace. When the maximum temperature is reached, the module is cooled by convection and thermal radiation. Convective cooling results when jets of a suitable gas impinge on the module. The jet diameter, jet-to-jet spacing and jet-to-module spacing are selected by known methods to maximize the cooling per unit of gas flow. The jets discharge from an array of nozzles that are in a jet-plate which faces the module. Gas flows into the nozzles from a plenum on the side of the jet-plate opposite the module. The plenum height and inlet flow diffuser are selected to insure uniform gas flow to each nozzle. Baffles divide the plenum into several chambers.

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Gas Jet Manifold for Module Cooling in Belt-Type Chip-Joining Furnaces

       Semiconductor chips are attached to a substrate by the
conventional soldering process in which a chip-substrate module is
placed on a belt that passes through a furnace. When the maximum
temperature is reached, the module is cooled by convection and
thermal radiation.  Convective cooling results when jets of a
suitable gas impinge on the module.  The jet diameter, jet-to-jet
spacing and jet-to-module spacing are selected by known methods to
maximize the cooling per unit of gas flow.  The jets discharge from
an array of nozzles that are in a jet-plate which faces the module.
Gas flows into the nozzles from a plenum on the side of the jet-plate
opposite the module. The plenum height and inlet flow diffuser are
selected to insure uniform gas flow to each nozzle.  Baffles divide
the plenum into several chambers.  The flow to each chamber is
adjusted to achieve the desired module cooling rate. Radiative
cooling is enhanced by making the jet-plate black so that radiant
heat emitted by the module is readily absorbed by the jet-plate.
(Only the surface facing the module must be blackened.)  Radiative
cooling is further enhanced by making the jet-plate of suitable
material and thickness so that the plate temperature rise as the
module cools is small.

      The drawing shows a chip-substrate module 1 under a jet-plate
2.  Gas jets that discharge from an array of nozzles 3 cool the
module by...