Browse Prior Art Database

Design of SMT Pad On Pad Connector

IP.com Disclosure Number: IPCOM000100890D
Original Publication Date: 1990-Jun-01
Included in the Prior Art Database: 2005-Mar-16
Document File: 2 page(s) / 35K

Publishing Venue

IBM

Related People

Dibble, EP: AUTHOR

Abstract

Disclosed is a high density pad on pad contact made by combining the design and assembly properties of a metallic disk to allow assembly in a surface-mount application.

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Design of SMT Pad On Pad Connector

       Disclosed is a high density pad on pad contact made by
combining the design and assembly properties of a metallic disk to
allow assembly in a surface-mount application.

      A sheet of nickel or some other nonwettable material is formed
on the top side with a connector geometry, usually in the form of one
or more Hertz dots.  A solderable metallurgy is plated or otherwise
coat ed to the bottom side of the nickel sheet; contact metallurgy
such as gold or palladium is plated to the top side.  The disks are
punched out, exposing the nonwettable side.

      The disks are then assembled through a pick and place or other
automated method into a connector array.  Through the assembly
process the bottom solderable surface allows the disk to self-center
through surface tension properties; the nonwettable sides protect the
top surface contact metallurgy from solder creep contamination.