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Anti-Condensation Heating by Heat-Conductive Printed Circuit Board

IP.com Disclosure Number: IPCOM000100935D
Original Publication Date: 1990-Jun-01
Included in the Prior Art Database: 2005-Mar-16
Document File: 1 page(s) / 37K

Publishing Venue

IBM

Related People

Shibuya, H: AUTHOR [+2]

Abstract

Disclosed is a technique to prevent condensation on a magnetic recording media surface in a hard disk drive by using a resistive heater made of polymer thick film which is formed on a heat-conductive printed circuit board.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 88% of the total text.

Anti-Condensation Heating by Heat-Conductive Printed Circuit Board

       Disclosed is a technique to prevent condensation on a
magnetic recording media surface in a hard disk drive by using a
resistive heater made of polymer thick film which is formed on a
heat-conductive printed circuit board.

      Condensation on magnetic media, especially on a thin film disk,
is said to be a major promoter of corrosion together with the
existence of flaws.  Known prevention methods against condensation
for non-operating time are the use of desiccant and heating.  For a
hard disk drive, the use of a desiccant is applicable to the shipping
time only, while heating can be used throughout its life as long as
the power is available during non-operating time.  Heating of the
rotating disk, however, requires non-contact heating, which then
requires a heater having a large radiation area. This has been one of
the restrictive factors for adaptation of this technique to a hard
disk drive.

      The technique disclosed here, under the assumption that a heat-
conductive material such as a ceramic or metal is used for the
printed circuit board, is to utilize a heat-conductive printed
circuit board as a large radiator of heat generated at a resistor
attached or formed on the board.  When the circuit itself is formed
as a polymer thick film, the resistor can be formed with the same
process. Increase in cost and space is negligible in this case.  When
direct forming is not possible...