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Browse Prior Art Database

Method for CTE Measurements of Thin Films

IP.com Disclosure Number: IPCOM000100942D
Original Publication Date: 1990-Jun-01
Included in the Prior Art Database: 2005-Mar-16
Document File: 2 page(s) / 65K

Publishing Venue

IBM

Related People

Davis, CR: AUTHOR [+3]

Abstract

Interfacial stresses resulting from coefficient of thermal expansion (CTE) mismatches between the different components comprising multilayer structures in microelectronics packaging result in a high probability of failure, i.e., delamination and film cracking during fabrication processes. The presence of such stresses thus results in a reduction of the performance and life characteristics of the product. Therefore, knowledge of the materials' properties that comprise the multilayer component, i.e., CTE, are required.

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Method for CTE Measurements of Thin Films

       Interfacial stresses resulting from coefficient of
thermal expansion (CTE) mismatches between the different components
comprising multilayer structures in microelectronics packaging result
in a high probability of failure, i.e., delamination and film
cracking during fabrication processes. The presence of such stresses
thus results in a reduction of the performance and life
characteristics of the product. Therefore, knowledge of the
materials' properties that comprise the multilayer component, i.e.,
CTE, are required.

      Commonly utilized techniques to measure the x and y CTEs of
thin films, extension probe analysis, involve the use of a thermal
mechanical analyzer (TMA) equipped with specialized hardware/software
from the instrument's vendor. This article describes a method which
permits x and y axis CTE measurements to be performed in the standard
expansion mode, thus not requiring special hardware/software changes
and updates as demanded by extension probe analysis.  The disclosed
method provides reproducible and accurate results and eliminates any
uncertainties associated in using an extension probe, i.e.,
difference in applied tension or slippage of the grips.

      By utilizing a special sample holder (see the figure), the
sample is oriented in a configuration that permits the thin film to
support a load, as required for expansion measurements.  Three
different thin film CTE measurements were made.  These were Upilex
S*, PEEK (Poly (ether ether ketone)), and CIC
(Copper-Invar**-Copper), respectively. The determinations...