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Browse Prior Art Database

Method of Detecting Delaminated Semiconductor Chip Passivation Layers

IP.com Disclosure Number: IPCOM000100947D
Original Publication Date: 1990-Jun-01
Included in the Prior Art Database: 2005-Mar-16
Document File: 1 page(s) / 23K

Publishing Venue

IBM

Related People

Henry, BC: AUTHOR

Abstract

Delamination of the quartz passivation layers on semiconductor chips can result in functional failure of the chip. As a result, chip lots are routinely inspected for evidence of delamination before being released for use.

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This is the abbreviated version, containing approximately 100% of the total text.

Method of Detecting Delaminated Semiconductor Chip Passivation Layers

       Delamination of the quartz passivation layers on
semiconductor chips can result in functional failure of the chip.  As
a result, chip lots are routinely inspected for evidence of
delamination before being released for use.

      Microscopic examination using normal or dark field illumination
can be used to identify most chips with delamination.  However, some
observations are ambiguous, and, on other chips, the delamination may
be too subtle to be seen.  In such instances, sectioning is usually
required to confirm the presence or absence of delamination.

      However, the combination of an oil immersion lens with
cross-polarized light can be used to quickly and non-destructively
determine whether delamination exists. With this technique, any
delaminated area will appear bright against a dark background.
Separations as small as 100Ao are easily detected by this method.