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Concept for Packaging Wafer-Scale-Integrated Parts Into Large Systems

IP.com Disclosure Number: IPCOM000100970D
Original Publication Date: 1990-Jun-01
Included in the Prior Art Database: 2005-Mar-16
Document File: 3 page(s) / 123K

Publishing Venue

IBM

Related People

Moulic, R: AUTHOR [+2]

Abstract

Described is a concept for packaging WSI (Wafer-Scale Integrated) parts into a large system using both optoelectronic and electric interconnects; it consists of the following (Figs. 1 and 2): 1. The wafers forming the system will be held in place (with their planes vertical to facilitate convectional cooling) and supported on their lower side by three or more mechanically sturdy (horizontal) fixture rods. 2. In these rods, heavy-duty power supply and ground connections will be incorporated. 3. A grounded metal-sheet and some high-dielectric material can be placed in the spaces between adjacent rods to provide the decoupling of the power-supply voltages. Other forms of capacitors can also be used to aid this coupling, among the rods as well as locally on the wafer. 4.

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Concept for Packaging Wafer-Scale-Integrated Parts Into Large Systems

       Described is a concept for packaging WSI (Wafer-Scale
Integrated) parts into a large system using both optoelectronic and
electric interconnects; it consists of the following (Figs. 1 and 2):
1.   The wafers forming the system will be held in place (with their
planes vertical to facilitate convectional cooling) and supported on
their lower side by three or more mechanically sturdy (horizontal)
fixture rods.
2.   In these rods, heavy-duty power supply and ground connections
will be incorporated.
3.   A grounded metal-sheet and some high-dielectric material can be
placed in the spaces between adjacent rods to provide the decoupling
of the power-supply voltages.  Other forms of capacitors can also be
used to aid this coupling, among the rods as well as locally on the
wafer.
4.   Over the upper rims of the wafers, clip-on interconnect-bars
will run (horizontal), to provide paths for signal communication.
For medium-speed signals, conventional electrical cables and contacts
will be used; for high-speed signals, opteolectronic connections.

      The packaging concept proposed will be based on a repair-by-
replacement scheme, which will physically use diced-out portions of a
wafer as the replacement parts.  In principle, such parts should, for
expediency, be "smallest repair-replaceable units" (SRRUs).  These
should be designed in accordance with the following concepts.  These
ideas have been proposed and described in [1,2].
1.   Circuits on a wafer will be organized into a number of
"functional islands" (FIs), which are to be the SRRUs.  These FIs
will be interconnected by normal wiring on-wafer.
           Conceptually,...