Dismiss
InnovationQ will be updated on Sunday, Oct. 22, from 10am ET - noon. You may experience brief service interruptions during that time.
Browse Prior Art Database

Precision Scriber for GaAs And InP Wafers

IP.com Disclosure Number: IPCOM000100994D
Original Publication Date: 1990-Jun-01
Included in the Prior Art Database: 2005-Mar-16
Document File: 1 page(s) / 42K

Publishing Venue

IBM

Related People

Richard, H: AUTHOR

Abstract

A clean and atomically flat surface of GaAs and InP crystals can be obtained by cleaving the crystal. For cleaving, the crystal is first scribed at one edge whereupon a bending force is applied. Under this force, the micro-cracks in the scribing area grow rapidly and finally the crystal cleaves along a crystal plane starting from one of the micro-cracks. Proposed is a scribing tool for precision cleaving within sub-micron tolerances. With this tool, the scribing trace can be tapered off very carefully, thus introducing micro-cracks only within sub-micron distances of the scribing trace. Under a bending force the crystal will cleave within this sub-micron tolerance. The tool is schematically shown in the figure.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 83% of the total text.

Precision Scriber for GaAs And InP Wafers

       A clean and atomically flat surface of GaAs and InP
crystals can be obtained by cleaving the crystal.  For cleaving, the
crystal is first scribed at one edge whereupon a bending force is
applied.  Under this force, the micro-cracks in the scribing area
grow rapidly and finally the crystal cleaves along a crystal plane
starting from one of the micro-cracks. Proposed is a scribing tool
for precision cleaving within sub-micron tolerances.  With this tool,
the scribing trace can be tapered off very carefully, thus
introducing micro-cracks only within sub-micron distances of the
scribing trace.  Under a bending force the crystal will cleave within
this sub-micron tolerance. The tool is schematically shown in the
figure.  It consists of:
(1)  A crystal holder 1 which can be moved horizontally as indicated;
its top surface 2, to which the crystal 3 can be attached, has an
inclination a of about 4 degrees; and
(2)  A diamond tip 4 attached to an arm 5 which can be lowered and
raised to two fixed positions; the weight on the diamond tip can be
adjusted.

      Scribing is done in the following way: The crystal 3 is placed
on the crystal holder 1 while the diamond tip 4 is in the upper (UP)
position.  Then the crystal holder is moved to the right and the
diamond lowered to the DOWN position. Now, the crystal holder is
moved from the right to the left. The height of the diamond is
adjusted so the that the crystal is onl...