Browse Prior Art Database

Custom Electro/Optical Interface Package

IP.com Disclosure Number: IPCOM000101006D
Original Publication Date: 1990-Jun-01
Included in the Prior Art Database: 2005-Mar-16
Document File: 3 page(s) / 79K

Publishing Venue

IBM

Related People

Marple, WP: AUTHOR

Abstract

A highly efficient electro/optical interface package is disclosed for both transmitting and receiving.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 59% of the total text.

Custom Electro/Optical Interface Package

       A highly efficient electro/optical interface package is
disclosed for both transmitting and receiving.

      A custom electro/optical interface package for interfacing
optical fibers to/from electronics internal to hybrid circuits is
shown in Fig.  1. On one face of the package are 13 flat glass-sealed
feedthrough leads which allow electrical contact to a printed circuit
board. On the opposite face of the package is 3 precision-machined
hollow pins. One end of each of the hollow pins contains a graded
index lens which is hermetically sealed to the inner wall of the pin.
The opposite end of the pin is hard brazed into the wall of the
package to form a hermetic seal at this interface. A light-emitting
diode (LED) or a positive- intrinsic-negative (PIN) diode, mounted on
a chip carrier, is inserted into the hollow pin from the inside of
the package and positioned such that the active area of the
transmitter or receiver device is located at the focal point of the
lens. The other two side surfaces of the package contain mounting
flanges with guide holes that provide thermal transfer and precision
alignment to a card frame (not shown). The package thus provides a
hermetically sealed environment with excellent thermal properties for
the hybridized electronics as well as performing the function of card
optical connector. Fig. 2 shows a magnified view of the LED/PIN diode
chip carrier. Chip carriers are made of beryllium oxi...