Browse Prior Art Database

Self-Clamping, Self Aligning Probe for Torsional Chip Removal

IP.com Disclosure Number: IPCOM000101027D
Original Publication Date: 1990-Jun-01
Included in the Prior Art Database: 2005-Mar-16
Document File: 4 page(s) / 138K

Publishing Venue

IBM

Related People

Grainer, G: AUTHOR [+2]

Abstract

Torsional chip removal techniques comprise subjecting the chip to torsional cycles by means of a torquing head or probe which fits over the chip to be removed. These techniques require that, prior to downwardly moving the probe towards the chip to have the probe fit over the latter, the longitudinal axis of the probe be precisely aligned with the center of the chip, so that the downward movement of the probe will result in the chip being freely contained within the probe aperture. Such a precise alignment has usually been achieved by means of complicated and/or costly implements for enabling the operator to finely adjust the position of the chip substrate-carrying stage relative to the probe, and to visually check the alignment.

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Self-Clamping, Self Aligning Probe for Torsional Chip Removal

       Torsional chip removal techniques comprise subjecting the
chip to torsional cycles by means of a torquing head or probe which
fits over the chip to be removed.  These techniques require that,
prior to downwardly moving the probe towards the chip to have the
probe fit over the latter, the longitudinal axis of the probe be
precisely aligned with the center of the chip, so that the downward
movement of the probe will result in the chip being freely contained
within the probe aperture.  Such a precise alignment has usually been
achieved by means of complicated and/or costly implements for
enabling the operator to finely adjust the position of the chip
substrate-carrying stage relative to the probe, and to visually check
the alignment.

      These techniques further require that care be exercised to
avoid stress concentrations upon the chip corners, during torquing of
the chip, that would normally crack or crush the chip material.

      The present probe structure is self-clamping, self-aligning,
and is designed so that the forces it applies to the chip during
torquing thereof, are evenly distributed over the lateral surfaces of
the chip.  The present probe includes a hollow, cylindrical body 10
having an outwardly radially extending annular portion 11 at its
upper end (Fig. 1).  Portion 11 is provided with two diametrically
opposite slots 12.  Body 10 is mounted within a hollow cylindrical
support and drive member 13, with the lower surface of portion 11
resting on top of member 13.  Projecting upwardly from the upper
surface of member 13 and secured thereto are two locating and driving
pins 14, each dimensioned and located so as to fit freely within its
associated slot 12. The outer diameter of body 10 is smaller than the
inner diameter of member 13, this allowing body 10 to move to some
extend relative to member 13.  The latter has a torque applying lever
15 affixed thereto and is rotatably supported on a vertically movable
bracket 16.  Mounted within hollow body 10 are four separate jaws 17,
each having an outwardly radially extending arm 18 whose lower
surface rests upon the upper surface of body 10.  Each arm 18 is
provided with a fixed pin 19 which fits freely within an...