Browse Prior Art Database

Stacked Surface Mount Package With Interposing Heat Sink

IP.com Disclosure Number: IPCOM000101040D
Original Publication Date: 1990-Jun-01
Included in the Prior Art Database: 2005-Mar-16
Document File: 1 page(s) / 29K

Publishing Venue

IBM

Related People

Lumbra, D: AUTHOR [+4]

Abstract

As shown in the figure, the heat sink 1 of varying heights and fin 2 designs is "interposed" between a pair of stacked modules 3 and 4, allowing both modules (especially the lower) to exhaust their heat to the air. The interposer section 5 is connected by a thermally conductive epoxy 6 to the modules. Cut outs 7 allow the leads 8 of the upper module to protrude through the heat sink to the lower module. The space directly above the upper module is kept clear to allow assembly of the upper module to the lower module. More than one stack could be placed in series to comprise a "strip" of modules, thereby reducing the card space occupied.

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Stacked Surface

Mount

Package

With Interposing Heat Sink

       As shown in the figure, the heat sink 1 of varying
heights and fin 2 designs is "interposed" between a pair of stacked
modules 3 and 4, allowing both modules (especially the lower) to
exhaust their heat to the air.  The interposer section 5 is connected
by a thermally conductive epoxy 6 to the modules.  Cut outs 7 allow
the leads 8 of the upper module to protrude through the heat sink to
the lower module.  The space directly above the upper module is kept
clear to allow assembly of the upper module to the lower module.
More than one stack could be placed in series to comprise a "strip"
of modules, thereby reducing the card space occupied.