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Rework Process for Insulator Via Holes

IP.com Disclosure Number: IPCOM000101076D
Original Publication Date: 1990-Jun-01
Included in the Prior Art Database: 2005-Mar-16
Document File: 2 page(s) / 34K

Publishing Venue

IBM

Related People

Cote, WJ: AUTHOR [+3]

Abstract

A process to refill incorrectly etched via holes in an insulating layer, e.g., when a wrong photomask is used, is comprised of an optional first sputter etch followed by conformal deposition of an insulator followed by anisotropic etch-back to planarize the surface and to reach a desired thickness. Photo definition and etching may then be performed correctly.

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Rework Process for Insulator Via Holes

       A process to refill incorrectly etched via holes in an
insulating layer, e.g., when a wrong photomask is used, is comprised
of an optional first sputter etch followed by conformal deposition of
an insulator followed by anisotropic etch-back to planarize the
surface and to reach a desired thickness.  Photo definition and
etching may then be performed correctly.

      Referring to Fig. 1, a via hole is incorrectly etched in
insulating layer 10 on substrate 12.  A sputter etch may then be used
which removes residual photoresist and tapers or facets top edges of
the hole as shown in Fig. 2. Insulating layer 14 is then conformally
deposited to a thickness sufficient to completely fill the hole as
shown in Fig.  2.  A planarization process is used to level the
surface and to create the desired thickness of oxide layers 10 and 14
as shown in Fig. 3.

      Correct photo definition and etching is then performed.