Browse Prior Art Database

Panel Heat Sink for VLSI Modules

IP.com Disclosure Number: IPCOM000101083D
Original Publication Date: 1990-Jun-01
Included in the Prior Art Database: 2005-Mar-16
Document File: 2 page(s) / 50K

Publishing Venue

IBM

Related People

Iguchi, Y: AUTHOR [+2]

Abstract

An air-cooling system for VLSI modules is disclosed in which a common panel heat sink is used for cooling of various modules having different heights. The system is simple to fabricate and effective to reduce the height of the heat sink/module assembly.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

Panel Heat Sink for VLSI Modules

       An air-cooling system for VLSI modules is disclosed in
which a common panel heat sink is used for cooling of various modules
having different heights.  The system is simple to fabricate and
effective to reduce the height of the heat sink/module assembly.

      Fig. 1 shows a panel-like heat sink 10 used in this cooling
system.  The heat sink 10, such as copper or aluminum, is formed to
have ventilation windows 11, ventilation holes 12 and depressions 13.
The windows 11 and the holes 12 can be formed at a time by punching.
The depressions 13 can be formed by embossing.

      As shown in Fig. 2, modules 15 which may have different heights
are mounted on substrate 14, and the heat sink 10 is placed on the
modules 15.  The depths of the depressions 13 are such that the
bottom surfaces of the respective depressions 13 come into contact
with the top surfaces of the corresponding modules 15 when the heat
sink 10 is disposed on the modules 15.  The heat sink 10 is bonded to
the modules by thermally conductive adhesive 16.

      The heat sink/module assembly is attached to system frame 17
with the use of a thermally conductive adhesive to further enhance
heat dissipation, as shown in Fig. 3.