Browse Prior Art Database

Heat-Resistant Plastic Tray for Plastic Leaded Chip Carrier Packages

IP.com Disclosure Number: IPCOM000101097D
Original Publication Date: 1990-Jun-01
Included in the Prior Art Database: 2005-Mar-16
Document File: 2 page(s) / 48K

Publishing Venue

IBM

Related People

Wada, T: AUTHOR

Abstract

A plastic tray for PLCC (Plastic Leaded Chip Carrier) packages is disclosed, which can achieve the same size (in particular, height) as the trays for PFPs (Plastic Flat Packages) such that the same equipment or tools can be used for handling both of the packages.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

Heat-Resistant Plastic Tray for Plastic Leaded Chip Carrier Packages

       A plastic tray for PLCC (Plastic Leaded Chip Carrier)
packages is disclosed, which can achieve the same size (in
particular, height) as the trays for PFPs (Plastic Flat Packages)
such that the same equipment or tools can be used for handling both
of the packages.

      Fig. 1 shows the present tray 10.  The tray 10 has a number of
pockets 12 arranged in rows and columns.  Only one pocket 12 is shown
in Fig. 1.  Each of the pockets 12 includes a pedestal portion 14 and
reinforcement ribs 16 around the pedestal 14.  The PLCC packages are
placed in the pockets 12 to sit on the pedestals 14.  The ribs 16 are
designed not to interfere with the leads 18 of the PLCC package
placed in the pocket 12 and also designed to achieve sufficient
mechanical strength with a tray as thin as the PFP tray.  The ribs 16
act as quideways for the heat-resistant resin in injection molding of
the tray to improve resin flow, thereby preventing a warp from
occurring in the tray.

      The tray 10 can handle two types of PLCC packages, i.e., small-
type and large-type.  The small-type package 20S is positioned in the
pocket 12 by inner portions of the leads 18 engaging with sidewalls
of the pedestal 14, as shown in the left portion of Fig. 3.  The
large- type package 2OL is positioned by outer portions of the leads
18 engaging with sidewalls of the pocket 12, as shown in the right
portion of Fig. 3.