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Application of Adhesion Promoter to Printed Circuit Board Cores at Dry Film Resist Apply

IP.com Disclosure Number: IPCOM000101105D
Original Publication Date: 1990-Jun-01
Included in the Prior Art Database: 2005-Mar-16
Document File: 2 page(s) / 60K

Publishing Venue

IBM

Related People

Banks, WF: AUTHOR [+3]

Abstract

Disclosed is a technique for the application of liquid adhesion promoters to printed circuit board (PCB) cores prior to dry film photoresist lamination.

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This is the abbreviated version, containing approximately 66% of the total text.

Application of Adhesion Promoter to Printed Circuit Board Cores at Dry Film Resist Apply

       Disclosed is a technique for the application of liquid
adhesion promoters to printed circuit board (PCB) cores prior to dry
film photoresist lamination.

      It is now common practice for increasing adhesion of aqueous
processing dry film photoresists to apply a liquid adhesion promoter
to the surface of PCB cores prior to lamination of photoresist to the
copper substrate surface.  Water is most commonly used for this
purpose.  The adhesion promoter increases the conformation and
adhesion of the resist to the substrate surface.  The liquid must be
distributed evenly as a fine film across the surface.

      Certain known methods of liquid application require accurate
liquid metering and distribution systems.  The application rollers
are typically covered with a two-layer cloth sock or open cell foam
rubber.  Maintaining adjustment and alignment is very time consuming.
A system not correctly adjusted results in non-uniform coverage of
the surface.  Parts of the surface can actually be dry or too wet.

      This method is an improvement on existing designs in that it
eliminates the need for accurate liquid metering and distribution.
There is no need for frequent operator intervention to maintain the
adjust ment of the liquid supply system.  Excess liquid is supplied
to the panel and is squeegeed off, leaving a fine uniform film of
water on the panel for r...