Browse Prior Art Database

Microcircuit Repair Wire Forming And Positioning Attachment

IP.com Disclosure Number: IPCOM000101108D
Original Publication Date: 1990-Jun-01
Included in the Prior Art Database: 2005-Mar-16
Document File: 2 page(s) / 44K

Publishing Venue

IBM

Related People

Chrzanowski, B: AUTHOR [+3]

Abstract

Disclosed is a device which allows a 1.6 mil diameter wire to be bent through a range of angles up to 90 degrees into a circuit conformal configuration.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

Microcircuit Repair Wire Forming And Positioning Attachment

       Disclosed is a device which allows a 1.6 mil diameter
wire to be bent through a range of angles up to 90 degrees into a
circuit conformal configuration.

      This formed repair segment can then be positioned overlapping
the section of circuit to be repaired.

      The device extends the raw card circuit repair capability of a
known brazing tool and allows this tool to braze-attach the preformed
wire to the section of circuit requiring repair.

      This device allows both the repair of jog angle and 90 degree
repair circuit configurations.

      The device can provide a repeatable consistent repair
replacement circuit something not easily achieved if wire were bent
manually using tweezers and the manual wire placement difficulty is
totally eliminated.

      The device bent conformal wire repair improves the raw card
circuit reliability when compared to a three-element cross ribbon
circuit repair technique.

      A wire guide tube supports the wire and forms the wire against
a retractable mandrel.

      The wire is extended the desired amount and forming against the
mandrel continues until the wire is shaped similar to the segment of
the circuit to be repaired.

      The device then positions the wire into place and the wire is
attached to complete the repair of the circuit.