Browse Prior Art Database

Multiplane Flexible Rework Appliques

IP.com Disclosure Number: IPCOM000101155D
Original Publication Date: 1990-Jul-01
Included in the Prior Art Database: 2005-Mar-16
Document File: 1 page(s) / 45K

Publishing Venue

IBM

Related People

Hays, TJ: AUTHOR [+3]

Abstract

Disclosed is a method for providing high density addition of wires to a printed wire assembly or board in order to facilitate an engineering change or accommodate wires that could not be incorporated into the raw board due to wire density. This method utilizes wiring patterns contained on both sides of a flexible plastic applique, which is attached to the board. This method is considerably faster and more accurate than current methods of placing individual wire segments manually or by numerically controlled machinery.

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Multiplane Flexible Rework Appliques

       Disclosed is a method for providing high density addition
of wires to a printed wire assembly or board in order to facilitate
an engineering change or accommodate wires that could not be
incorporated into the raw board due to wire density.  This method
utilizes wiring patterns contained on both sides of a flexible
plastic applique, which is attached to the board.  This method is
considerably faster and more accurate than current methods of placing
individual wire segments manually or by numerically controlled
machinery.

      This method is a modification of that described in the
preceding article and is intended for relatively high density rework
wiring.  See the preceding article for a more complete description of
the basic process.  The use of multi-plane appliques requires more
expensive and precise processing.  In this case, a sheet of
transparent plastic insulator is clad with 1 ounce of copper on both
sides.  The panel is exposed and etched on both sides to form the
desired land patterns.  The land patterns that will be placed in
contact with the board being reworked will require geometries
different from those used on the opposite surface of the applique.
The connection hole diameters will be reduced and the contact pad
will cover only 90 degrees of the circumference of the hole (shown in
the figure). Contact pads are made in this pattern so that adjacent
land patterns are outside the tolerance range of un...