Browse Prior Art Database

Angular Bonding Tool

IP.com Disclosure Number: IPCOM000101227D
Original Publication Date: 1990-Jul-01
Included in the Prior Art Database: 2005-Mar-16
Document File: 2 page(s) / 50K

Publishing Venue

IBM

Related People

Carden, GR: AUTHOR [+4]

Abstract

Disclosed is a tool which allows bonding of wires in a package assembly using automated wire bonders where bond pads or pins are in non-parallel multiple planes.

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Angular Bonding Tool

       Disclosed is a tool which allows bonding of wires in a
package assembly using automated wire bonders where bond pads or pins
are in non-parallel multiple planes.

      Prior wire-bond interconnection techniques require component
bond pads or pins to all be in parallel planes, although they can be
at various heights.  This tool allows the package with components
mounted to be angularly positioned for each bond site.   This allows
component and device mounting on any available package surface.

      The component bond pads on the package can be precisely
angularly aligned to the bond tool capillary or wedge (Fig. 1).  Once
the initial bond is completed, the bond tool lifts and allows the
package, which is held in the bonding tool, to be rotated to
precisely align the subsequent bond pad. Using this tool allows
crossovers, busing, commoning and jumpering between devices and
components which lie in different angular planes.  Fig. 1 shows bond
position for a device 1 with a header at 90 degrees to the wire-bond
capillary.  Rotating the fixture after the first bond on device 1,
Fig. 2 shows the final bond made to device 2 at some angle from the
initial bond on device 1.  Fig. 3 demonstrates that devices 3 and 4
on different planes could also be bonded by rotation of the header in
the fixture.

      Figs. 4A and 4B show the fixture in two positions. Fig. 4A
corresponds to the Fig. 1 wire-bond position.  Fig. 4B corresponds to...