Browse Prior Art Database

Automatic System for Single Wafer Reactive Ion Etching

IP.com Disclosure Number: IPCOM000101236D
Original Publication Date: 1990-Jul-01
Included in the Prior Art Database: 2005-Mar-16
Document File: 4 page(s) / 111K

Publishing Venue

IBM

Related People

Giammarco, NT: AUTHOR [+5]

Abstract

A comprehensive reactive ion etching (RIE) system has been proposed for the processing of large semiconductor wafers. The automated system has the capability of handling both corrosive and non-corrosive gases and includes a rapid recovery dual cryostage pump, a toxic gas trap and disposal system, means for adjusting reactor electrode spacing and specially designed dual-load locks.

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Automatic System for Single Wafer Reactive Ion Etching

       A comprehensive reactive ion etching (RIE) system has
been proposed for the processing of large semiconductor wafers. The
automated system has the capability of handling both corrosive and
non-corrosive gases and includes a rapid recovery dual cryostage
pump, a toxic gas trap and disposal system, means for adjusting
reactor electrode spacing and specially designed dual-load locks.

      The block diagram (Fig. 1) and the isometric sketch (Fig. 2)
show the essential elements in the system.  Wafers being processed
are robotically loaded/unloaded for movement in and out of the
transfer cham ber and then into a dual-load lock prior to entering
the process chamber.  This lock serves to maximize run-to-run
reliability while at the same time making it possible to pre-treat or
post-treat wafers as necessary.

      The process chamber has been designed with a non-metallic
porous cathode.  It has the capability to adjust electrode spacing to
optimize the electrical field and species diffusion for an associated
gas chemistry.  This increases process flexibility and improves
plasma density tailoring polymerization.

      The cryogenic traps provide for very high-speed moisture
removal and very high-speed regeneration.  The cryogenic advantages
are also extended to the waste gas vessel making it possible to
safely handle corrosive and/or toxic gases which may exist.  The
basic vacuum system has a drawdow...