Browse Prior Art Database

Method for Removing Area Array Smt Modules From Boards

IP.com Disclosure Number: IPCOM000101269D
Original Publication Date: 1990-Jul-01
Included in the Prior Art Database: 2005-Mar-16
Document File: 1 page(s) / 39K

Publishing Venue

IBM

Related People

Kryzaniwsky, BR: AUTHOR

Abstract

Disclosed is a method that makes it possible to remove a surface- mounted module containing area array matrix of I/O solder column or ball connections.

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This is the abbreviated version, containing approximately 100% of the total text.

Method for Removing Area Array Smt Modules From Boards

       Disclosed is a method that makes it possible to remove a
surface- mounted module containing area array matrix of I/O solder
column or ball connections.

      The increasingly large number of I/O interconnections on a
semiconductor carrier (module), such as a chip carrier, containing
solder bumps (columns or balls), arranged in an area array matrix,
which are soldered to a mounting pad on a circuit board by means of
Surface Mount Technology (SMT), may be a burden when removing the
module by conventional state-of-the-art hot air methods.

      The proposed method suggests a non-destructive means of carrier
or module removal by utilizing a matrix of heating wire probes that
penetrate the I/O vias from the back side of the circuit board.  As
the heating wire matrix is passed through the plated I/O thru-holes,
as shown in the figure, the solder is heated to its melting point and
the module or carrier can be lifted by a vacuum chuck off its board
mounting pads.

      The movement of the heating wire matrix fixture can be motion
and/or temperature controlled to provide melt and runoff of the
joining solder in the plated thru-holes and on the board mounting
pads.