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Browse Prior Art Database

Module Clamping Device

IP.com Disclosure Number: IPCOM000101341D
Original Publication Date: 1990-Aug-01
Included in the Prior Art Database: 2005-Mar-16
Document File: 2 page(s) / 55K

Publishing Venue

IBM

Related People

Boswell, GP: AUTHOR [+2]

Abstract

A heat dissipating clamp is required to clamp vertically mounted components on a board against a cool metal subframe with sufficient force to thermally conduct heat into the subframe.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

Module Clamping Device

       A heat dissipating clamp is required to clamp vertically
mounted components on a board against a cool metal subframe with
sufficient force to thermally conduct heat into the subframe.

      Design requirements for the clamp were:  that it should be
subassembled separately to save in-plant assembly time and cost, with
self-retaining parts to avoid loss in transit, later assembly
processes or field replacement;  to remain clamped under shock or
vibration, be simple to operate repeatedly, and obviate the need to
remove any pre- assembled parts. Assembly Description

      The spring 2 in Fig. 1 is positioned on top of the two pivot
lugs 5 in frame 3 and under center retaining flap 6. Two rubber
retaining sleeves 4 are slipped over pivot lugs 5.  The lever 1 is
used to push back rubber sleeves 4 to expose slots in lugs 5, and is
then dropped into slots 5 and pulled back to the pivot position.  The
rubber sleeves 4 now prevent the lever 1 and spring 2 from
disengaging.  The assembly is now as shown in the open position (Fig.
2).  The board 8, with module/s 7 mounted, is slid into frame 3 so
that the modules 7 pass behind the open clamps (Fig. 3). Levers 1 are
then rotated toward the top of frame 3 to clamp modules 7 (Fig. 4
A/B).  Levers 1 are effectively cams which exert a force onto the
springs 2 and provide an "over center" locking feature.