Browse Prior Art Database

High Density Memory Package

IP.com Disclosure Number: IPCOM000101360D
Original Publication Date: 1990-Aug-01
Included in the Prior Art Database: 2005-Mar-16
Document File: 3 page(s) / 99K

Publishing Venue

IBM

Related People

Dietsch, HE: AUTHOR [+2]

Abstract

A high density semiconductor memory/logic package is disclosed which offers improved thermal efficiency, circuit density, electrical performance, structural integrity, and ease of assembly/disassembly.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 59% of the total text.

High Density Memory Package

       A high density semiconductor memory/logic package is
disclosed which offers improved thermal efficiency, circuit density,
electrical performance, structural integrity, and ease of
assembly/disassembly.

      To create byte-wide memory packages, single in-line memory
modules are attached to a circuit card. Subsequently, the cards are
plugged into sockets attached to a board containing a memory bus.
This architecture results in long wiring lengths and inductive loads
which impair the performance of fast access time (< 50 ns) memory
chips. A new high density memory package is shown which offers
advantages over those found in the current technology.

      By mounting solder ball connecting chips directly to a thermal
coefficient of expansion constrained single in-line packaged card,
byte-wide structures can be fabricated. Several cards may be
assembled into a package to form a dense multi-byte memory. The short
wiring lengths and low inductance connections produce a high
performance package while providing efficient thermal performance
through an integrated heat sink.

      Referring to Fig. 1, a single in-line package is shown with
nine memory devices directly attached to a two-signal/two-power
(2s/2p) constrained thermal coefficient of expansion (TCE) card. The
signal and power levels are constructed so that the upper portion of
the card does not contain any wiring, but exposes the card's TCE
constraining metal core, form...