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Method of Preparing Multilayer Magnetic Films

IP.com Disclosure Number: IPCOM000101365D
Original Publication Date: 1990-Aug-01
Included in the Prior Art Database: 2005-Mar-16
Document File: 2 page(s) / 43K

Publishing Venue

IBM

Related People

Dove, DB: AUTHOR [+5]

Abstract

Disclosed is a method of preparing multilayer permalloy films by sputtering from a single target. By control of the ratio of nitrogen to argon in the sputtering gas, the deposited film may range from high magnetic quality to non-magnetic. The figure shows a plot of the magnetization of single layer films as a function of nitrogen content in the gas mixture. In the figure, the abrupt magnetic to non-magnetic transition occurs as nitrogen content is increased. Thus, a multilay er structure of magnetic and non-magnetic layers may be deposited by varying the nitrogen concentration from layer to layer. This method eliminates difficulties arising in conventional multilayer processes where two or more dissimilar materials are deposited from multiple targets in succession.

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Method of Preparing Multilayer Magnetic Films

       Disclosed is a method of preparing multilayer permalloy
films by sputtering from a single target.  By control of the ratio of
nitrogen to argon in the sputtering gas, the deposited film may range
from high magnetic quality to non-magnetic.  The figure shows a plot
of the magnetization of single layer films as a function of nitrogen
content in the gas mixture. In the figure, the abrupt magnetic to
non-magnetic transition occurs as nitrogen content is increased.
Thus, a multilay er structure of magnetic and non-magnetic layers may
be deposited by varying the nitrogen concentration from layer to
layer.  This method eliminates difficulties arising in conventional
multilayer processes where two or more dissimilar materials are
deposited from multiple targets in succession.

      Nitrogen, ammonia, and/or a mixture of nitrogen and hydrogen
may also be introduced into the argon gas to reactively nitride the
films.  Further, a small quantity of ammonia and/or hydrogen, mixed
with the pure nitrogen, improves process control and the resultant
properties, such as resistivity, of the non-magnetic interlayers.

      The present method substantially reduces pin holes or magnetic
threads from layer to layer as they are unlikely to form due to the
reactive nitriding process.  It will be noted that the interlayers
may have magnetic characteristics which are different from the
magnetizing qualities of magnetically perme...