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Browse Prior Art Database

Tab Sink

IP.com Disclosure Number: IPCOM000101376D
Original Publication Date: 1990-Aug-01
Included in the Prior Art Database: 2005-Mar-16
Document File: 3 page(s) / 92K

Publishing Venue

IBM

Related People

Ledermann, PG: AUTHOR [+3]

Abstract

Thermally conductive and dissipative structures fabricated on a metal tape having the same format as a bonding tape are provided for cooling VLSI chips. The structures all comprise a square central area which is attached to the chip, and four generally trapezoidal wings which extend either down or up from the chip. In the convective arrangements, the wings are placed in a position to dissipate heat by convection, while in the conductive arrangements, the wings attach to a substrate, a thermal bus, or the like which conduct the heat away. The provided structures are in contrast to the cooling techniques of the art which include directly attaching the chip to a substrate via thermal grease, cement or solder, and extending the size of the package to spread the heat over a larger area.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 52% of the total text.

Tab Sink

       Thermally conductive and dissipative structures
fabricated on a metal tape having the same format as a bonding tape
are provided for cooling VLSI chips.  The structures all comprise a
square central area which is attached to the chip, and four generally
trapezoidal wings which extend either down or up from the chip.  In
the convective arrangements, the wings are placed in a position to
dissipate heat by convection, while in the conductive arrangements,
the wings attach to a substrate, a thermal bus, or the like which
conduct the heat away. The provided structures are in contrast to the
cooling techniques of the art which include directly attaching the
chip to a substrate via thermal grease, cement or solder, and
extending the size of the package to spread the heat over a larger
area.

      A tape design or structure 10 for a convective or conductive
chip cooling structure is seen in Fig. 1a.  The tape 15 is seen to
have the same format as the tape used for tape automated bonding
(TAB), and thus sprocket holes 20 are provided for reels which would
expedite alignment and automation.  Preferably, the tape 15 is copper
or aluminum, although other thermal conductors may be employed.  If
desired, the provided design 10 may occupy an alternate frame with a
TAB chip attach site, and in that case, the tape 15 should be copper.

      The tape design 10 is provided for cooling chips which sit atop
a circuit board or layer, as indicated by I/O leads 55a and 55b in
Fig.  2a.  Structure 10 is seen to have a square central area 20, and
four trapezoidal wings 25a, 25b, 25c and 25d.  As indicated in Fig.
2a, the central area 20 is attached to the back of chip 50 which is
to be cooled.  Attachment is made by solder reflow, thermally
conductive cement, eutectic soldering, thermoco...